International Conference on Physical Assurance and Inspection of Electronics (PAINE) offers an exciting venue to researchers and practitioners in the field of Hardware Security and Trust who research and develop physical assurance and analysis. PAINE brings together experts from government, instrumentation, original component manufacturers (OCMs), original equipment manufacturers (OEMs), and academic researchers together to share ideas and solutions to make electronics devices and systems safe and secure.
Topics covered are including but not limited to:
- Security primitives: Novel devices, materials, and systems
- New metrologies for characterization and assurance
- Test vehicles and performance quantification
- Additive manufacturing assurance for electronics
- Physical and design interface assurance
- Trojans and backdoors: Detection and prevention
- Workforce Development
- Advanced packaging and heterogenous integration
- Fault injection assessment and countermeasures
- Side channel assessment (power, timing, EM) for assurance and countermeasures
- Analog & mixed-signal circuits and systems security
- FPGA Bitstream protection and vulnerabilities
- Emerging topics in physical inspection and assurance
- Counterfeit Detection and Anti-Counterfeit Technique
- Image analysis and artificial intelligence for assurance and inspection
- Novel material and devices for assurance
- Sample Preparation
- PCB trust and assurance
- Chip and PCB level decomposition for assurance
- FIB/SEM for assurance
- Electro-optical probing using PEM, EOP, EOFM, etc.
- Physical/side channel fingerprinting
- Mod-chip on PCB
- Microprobing and nanoprobing
- Bus-snooping
- Field-based weakness
- Countermeasures against tampering and decomposition
- Metrologies characterization
- Functionality validation
- Process improvements
- Failure analysis and fault isolation
- Automated inspection for advanced packaging
- Physical/logical shielding, etc.
DEADLINES
Full Paper Submission
(6 pages +1 page for
references):
Notification of Acceptance:
Camera Ready Version:
July 19th,2024
Aug 9th, 2024
Sep 2nd, 2024
CONTACT INFORMATION
Navid Asadi (General Chair)
University of Florida
E-mail: nasadi@ufl.edu
Christopher.J.Bailey
E-mail: Christopher.J.Bailey@asu.edu
Chris Bailey (Program Chair)
Arizona State University
Submission and Review Process
Please prepare your paper in Standard IEEE 2-column PDF format.
You can submit your paper by using Easy Chair Smart CFP portal.
IEEE PAINE publications will use a Single-blind review format.
Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
Accepted papers and posters are required to be presented at the conference for the papers to be published at the IEEE Xplore.
Each presenter (paper/poster) cannot present more than two papers/posters.