November 11, 2024
19:00
|
21:00
HIR Special Session
Speakers:
HIR Overview: William Chen – ASE (U.S.) Inc.
Security: Navid Asadi – University of Florida
Modelling and Co-Design: Chris Bailey – Arizona State University
Metrology: Jan Vardaman – TechSearch International, Inc.
07:30
|
08:45
Registration & Breakfast
08:45
|
09:00
Opening Remarks – PAINE 2023 Awards
General Chair and Program Chair
Plenary Session I
Chair: Dr. Bahar Basim – Intel
09:00
|
09:40
Keynote Talk I: Challenges for Advanced Packaging
in the Chiplet Era
Jan Vardaman -Tech Search International, Inc.
09:40
|
10:20
Keynote Talk II: Microelectronics Assurance
Jeff Krieg – National Security Agency
10:20
|
10:40
Break
SESSION I: Invited Talk
Chair: Dr. Je-Hyeong Bahk – University of Cincinnati
10:40
|
11:00
Extreme In-packaging Compute Density using
Superconducting Materials and Cryogenic Cooling
Dr. Anna Herr – IMEC
11:00
|
11:20
Towards Digital Twin Standards in CMP Process
as a Model for Advanced Packaging
Dr. Yaw Obeng – NIST
11:20
|
11:40
3DInterconnect Inspection for Chiplet Packaging
using White-light Scanning and Phase Shifting
Interferometry
Dr. Sang-Yoon LEE – Intekplus
11:40
|
12:00
Hybrid Bonding a Key Enabling Technology for Chiplet
Integration
Dr. Charles Woychik – NHanced Semiconductors, Inc.
12:00
|
13:00
Lunch
Plenary Session II
Chair: Dr. Nick Hooten – Invariant Corp.
13:00
|
13:40
Keynote Talk III: CHIPS for America:An Update
on the NSTC
Dr. Greg Yeric –National Semiconductor Technology
Center
SESSION II: PANEL DISCUSSION I
Moderator: Saverio Fazzari – Booz Allen Hamilton
13:40
|
15:00
Advanced Packaging Technology Challenges for
Assurance
Speakers:
Dr. Carl McCant -DARPA
Dr. Len Orlando – Ansys Government Inititives (AGI)
Dr. Anthony Hill – Texas Instruments
Brandon Hamilton – BAE Systems, Inc.
Dr. Christopher Bailey – Arizona State University
15:00
|
15:30
Break
SESSION III-A: Paper Presentations
Chair: Dr. Biswajit Ray – Colorado State University
15:30
|
15:50
Fault-Injection Countermeasures, Deployed at Scale
Carlos Tokunaga – Intel Corporation
15:50
|
16:10
Physical Layout Extraction via Ion Milling based IC
Delayering for Reverse Engineering Applications
Shuvodip Maitra – Indian Institute of Technology Kharagpur
16:10
|
16:30
CAKE-SiP: Chiplet Authenticate & Key Exchange
for Secure Provisioning in System-in-Package
Md Sami Ul Islam Sami – University of Florida
16:30
|
16:50
Evaluation of Terahertz Time Domain Spectroscopy for
Uncovering Dosimetric Properties of Microelectronic
Materials
Daniel Heligman – Riverside Research
SESSION III-B: Workshop I
Location: Discovery
15:30
|
17:00
Lionel Rivière – eShard
16:50
|
17:50
Exhibit and Poster Session
17:50
|
19:00
Social Event
End of Day 1
07:00
|
08:00
Breakfast
Plenary Session III
Chair: Sanjay Rekhi – NIST
08:00
|
08:40
Keynote Talk IV :CHIPS for America: An Update on
the NAPMP
Dr. George Orji – National Advanced Packaging
Manufacturing Program
SESSION IV: Paper Presentations
Chair: Dr. Nelson Hastings – NIST
08:40
|
09:00
Reverse-Engineering and Data Extraction
from SRAM using Photon Emission Analysis
Rodrigo Silva Lima – ALPhANOV – Mines Saint-Etienne
09:00
|
09:20
Securing Silicon Photonics Supply Chain Threats and
Opportunities
Liton Kumar Biswas – University of Florida
09:20
|
09:40
Third-Party IP Verification and Validation for Post-Silicon
Recovered Designs
Joshua Delozier – Battelle Memorial Institute
09:40
|
10:00
Assessing Magnetic Attack on Commercial 40nm pMTJ
STT-MRAM
M. Sojib Ahmed – Colorado State University
10:00
|
10:30
Break
SESSION V: PANEL DISCUSSION II
Moderators:
Nathan Edwards – Rapid Innovation & Security Experts, Inc.
Dr. Erin Gawron-Hyla – DoD Microelectronics Commons
10:30
|
12:00
Working Toward Effective Microelectronics Workforce
Development
Speakers:
Hayley Atwater – DEVCOM Armaments Center
Dr. Tamara Moore – Purdue University
Mark T. McMeen – STI Electronics Inc.
Saverio Fazzari – Booz Allen Hamilton
12:00
|
13:00
Lunch and Exhibit
SESSION VI: Special Session on
CHIPS Metrology
13:00
|
13:45
Welcome and CHIPS Keynote
Dr. Paul Hale – CHIPS Metrology Deputy Director
13:45
|
15:15
CHIPS Metrology Funded Project Team Lightning Talks and Panel
Session I
Moderator: Antara Nandi, CHIPS Metrology Program Manager
Lightning Talks and Speakers:
• Nanoscale, Element-Specific X-ray Imaging for Integrated Circuit
Metrology – Nathan Nakamura
• Non-destructive Defect Detection Metrology for Semiconductor
Advanced Packaging – Felix Kim
• Electron-Solid Interactions – Dr. Andras Vladar
• Time-resolved Emission Microscopy for Circuit Evaluation and
Failure Analysis – Brandon Cage
• Memory Device Characterization Platform – Karthick Ramu
• Metrology for Integration of New Magnetic Materials – Dr. Jim
Booth
15:15
|
15:30
Break
15:30
|
17:00
CHIPS Metrology Funded Project Team Lightning Talks and Panel
Session II
Moderator: Dr. Bob Keller, CHIPS Metrology Program Manager
Lightning Talks and Speakers:
• Reliability of 2D and GaN – Dr. Elisabeth Mansfield
• Accurate Cure Kinetics, Stress and Warpage Warpage Measure-
ments for Next-Generation Microelectronics Packaging with High
Thermo-Mechanical Reliability – Dr. Stian Romberg
• Nanocalorimetry for Semiconductors and Semiconductor Process
Metrology – Dr. Feng Yi
• Characterization of Nano-to-Microscale Process-induced Thermo-
mechanical Changes in Heterogeneously Integrated Micro-
electronics – Dr. Gheorghe Stan
• Metrology of Materials, Surfaces, and Processes for Hybrid
Advanced Packaging – Richard A. Allen
• Micromechanical Property Measurements of Materials for Hetero-
geneous Integration in Advanced Packaging – Dr. Li-Anne Liew
17:00
|
17:15
Closing Remarks – Dr. Paul Hale, CHIPS Metrology
Deputy Director
End of Day 2
07:00
|
08:00
Breakfast
Plenary Session IV
Chair: Dr. Mike DiBattista – Varioscale Inc.
08:00
|
08:40
Keynote Talk V : Semiconductor Manufacturing and
Advanced Packaging Supply Chain Security
Dr. Pauline Paki – Department of Homeland Security
08:40
|
09:10
Keynote Talk VI : Hardware Assurance for Chips: What
Can We Learn from Failure Analysis Techniques?
Dr. Chee Lip Gan – Nanyang Technological University, Singapore
09:10
|
09:40
Break
SESSION VII: Paper Presentations
Chair: Parth Shah – Intel Corporation
09:40
|
10:00
Towards Reducing Costs of Side Channel Analysis for
Real Time Algorithm Detection
Kevin Pintong – Binghamton University
10:00
|
10:20
Cover to Uncover: Comprehensive Study of Occlusion in
DL-based SCA
Emanuele Strieder – Fraunhofer Institute for Applied and Integrated
Security
10:20
|
10:40
Pre-Silicon Side-Channel Analysis of AI/ML Systems
Aydin Aysu – North Carolina State University
10:40
|
11:00
Break
SESSION VIII: Invited Talk
Chair: Dr. Hadi Kamali -University of Central Florida
11:00
|
11:20
Accelerating Innovation with Assurance
David Via – Midwest Microelectronics Consortium (MMEC)
11:20
|
11:40
Trust vs Risk: the Paradigm Shift in Critical Global
Supply Chains
Dr. Andrew Stern – DUST Identity
11:40
|
12:00
TBD
Beau Bakken – Caspia Technologies
12:00
|
12:20
The Evolution of the Counterfeit Electronics Parts Threat
and Advanced Mitigation Techniques
Jason Romano – SMT Corp
12:20
|
13:20
Lunch
SESSION IX: Paper Presentations
Chair: Dr. Ustun Sunay – Invariant Corp
13:20
|
13:40
SPICED: Syntactical Bug and Trojan Pattern
Identification in A/MS Circuits using LLM-Enhanced
Detection
Jayeeta Chaudhuri – Arizona State University
13:40
|
14:00
In-Situ FPGA Fault Injection with Short-Circuits
Garren Dutto – Oregon State University
14:00
|
14:20
Using Near-Field Electromagnetic Side Channels for
Efficiently Fingerprinting Wireless Modules
Vishnuvardhan Iyer – National Institute of Standards and
Technology/The University of Colorado Boulder
14:20
|
14:40
United We Protect: Protecting IP Confidentiality with
Integrated Transformation and Redaction
Sudipta Paria – University of Florida
14:40
|
15:00
Dendritic Identifiers as Oracles in Microelectronics
Michael Kozicki – Arizona State University
15:00
|
15:20
Break
SESSION X: Paper Presentations
Chair: Dr. Aubrey Beal – The University of Alabama in Huntsville
15:20
|
15:40
Vision Transformers for Counterfeit IC Detection
Chaitanya Bhure – UNC Charlotte
15:40
|
16:00
Evaluating the Efficacy of the ResCav System in
Distinguishing Integrated Circuits Across Manufacturers,
Series, and Lots
Aditya Nechiyil – The Ohio State University
16:00
|
16:20
Adversarial Attack Against Golden Reference-Free
Hardware Trojan Detection Approach
Ashutosh Ghimire – Wright State University
16:20
|
16:40
Enhancing Product Assurance and Reliability through a
Machine Learning-Based Data Analysis System
Dohun Kim – Electronics and Telecommunications Research
Institute
16:40
|
17:00
Broadening the Semiconductor Talent Pipeline with Non-
Engineering Students
George Clark – University of South Alabama
17:00
|
17:10
Closing Remarks
General Chair and Program Chair