All recorded sessions will be available on the conference platform until February 1st, 2022
11:45 | 12:00
Opening Remarks
General Chair and Program Chair
Plenary Session
12:00 | 12:35
Keynote Talk I: Can Chips be Hardened Against Attacks During Physical Design?
Serge Leef – DARPA
12:35 | 12:45
Live Q&A
SESSION I: Invited Talks I
12:45 | 13:05
Computed Tomography Challenges of Inspection of Navy Electronics.
Kyle Stoll – Navy Crane
13:05 | 13:25
Advanced Digital Forensics Investigations: Toward Systematic Threat Hunting &
Incident Response
Dr. Amin Termeh Yousefi – Facebook
13:25 | 13:45
Surface and Subsurface Electrical Measurements Using Scanning Microwave
Impedance Microscopy
Nicholas Antoniou – PrimeNano
13:45 | 14:00
Live Q&A
14:00 | 14:15
Facebook Break (Diamond Sponsor)
SESSION II: Live Panel Discussion I
14:15 | 15:30
Secure Heterogeneous Packaging
Panelists:Dr. Darren Crum (Navy), Peter O Donnell (Army), Dan Toohey (Mercury), John
Stephens (Raytheon), Brian Sapp (I3 Microsystems)
Moderator: Saverio Fazzari (Booz Allen Hamilton)
SESSION III: Image Analysis and Artificial Intelligence for Assurance I
15:30 | 15:50
Preparation, Imaging, and Design Extraction of the Front-End-of-Line and Middle-of-Line
in a 14 nm Node FinFET Device
Adam R. Waite – Battelle Memorial Institute
15:50 | 16:05
ViTaL: Verifying Trojan-Free Physical Layouts through Hardware Reverse Engineering
Matthias Ludwig – Infineon Technologies AG
16:05 | 16:20
Microelectronics Failure Prediction and Localization from Optical and Thermal Imagery
Md Alimoor Reza – Indiana University
16:20 | 16:35
Live Q&A
SESSION IV: Side Channel Attacks
16:35 | 16:50
Visualizing Electromagnetic Fault Injection With Timing Sensors
Michael Paquette – MITRE
16:50 | 17:05
Wavelet Selection and Employment for Side-Channel Disassembly
Random Gwinn – Johns Hopkins University
17:05 | 17:20
Exposing Data Value On a Risc-V Based SoC
Ezinam Bertrand Talaki – CEA/LETI
17:20 | 17:35
Live Q&A
Closing Day 1
Day 2 (December 1, 2021)
12:00 | 12:35
Keynote Talk II: Heteregenoues Packaging
John Oakley – Semiconductor Research Corporation
12:35 | 12:45
Live Q&A
SESSION V: Invited Talks II
12:45 | 13:05
E-beam Probing: A High-Resolution Technique to Read Volatile Logic and Memory
Arrays on Advanced Technology Nodes
Jennifer Huening – Intel Corporation
13:05 | 13:25
Backside Integrated Circuit Magnetic Field Imaging with a Quantum Diamond
Microscope
Dr. Edlyn V. Levine – MITRE
13:25 | 13:45
Defect Detection and Classification in PCB Manufacturing using Amazon Web Services
Elizabeth Samara, Prashanth Ganapathy – Amazon Web Services
13:45 | 14:00
Live Q&A
14:00 | 14:15
Allied Break – (Platinum Sponsor)
SESSION VI: Live Panel Discussion II
14:15 | 15:30
Advances in Analog Domain Security and IC Fingerprinting
Panelists:Dr. Norman Chang (Ansys), Doug Gardner (Analog Devices), Dr. Thomas
Kent (Battelle)
Moderator: Dr. Richard Ott, AFRL
SESSION VII: Image Analysis and Artificial Intelligence for Assurance II
15:30 | 15:45
Deep Learning-Based Approaches for Text Recognition in PCB Optical Inspection: A Survey
Shajib Ghosh – University of Florida
15:45 | 16:00
ChangeChip: A Reference-Based Unsupervised Change Detection for PCB Defect Detection
Yehonatan Fridman – Israel Atomic Energy Commission
16:00 | 16:15
Automated Trace and Copper Plane Extraction of X-ray Tomography Imaged PCBs
Ulbert Botero – University of Florida
16:15 | 16:30
Live Q&A
SESSION VIII: FPGA Bitstream protection and vulnerabilities
16:30 | 16:45
Two-Photon Optical Beam Induced Current for Circuit Level Verification and Validation of a 130 nm Microelectronic Device
Jeffrey Simon – Battelle Memorial Institute
16:45 | 17:00
Bitstream Reverse Engineering of Microsemi’s VersaTile-based FPGAs
Yongseen Kim – Electronics and Telecommunications Research Institute, South Korea
17:00 | 17:15
Patchable Hardware Security Module (PHaSM) for Extending FPGA Root-of-Trust Capabilities
Christopher Sozio – NAVSEA Crane
17:15 | 17:30
Live Q&A
Closing Day 2
Day 3 (December 2, 2021)
12:00 | 12:35
Keynote Talk III: SI Traceability for 5G Hardware Authentication
Dr. Paul Hale – National Institute of Standards and Technology
12:35 | 12:45
Live Q&A
SESSION IX: Invited Talk Session III
12:45 | 13:05
The 7 Habits of Highly Effective Security-Aware Design Automation
Jason Fung – Intel Corporation
13:05 | 13:25
Automation for Hardware and Supply Chain Assurance
Beau Bakken – Caspia Technologies
13:25 | 13:45
Recent Advances in Circuit-level Techniques to Kill the EM Side Channel Leakage at Its
Source
Dr. Shreyas Sen – Purdue University
13:45 | 14:00
Live Q&A
14:00 | 14:20
Gold Sponsors Break
SESSION X: Countermeasures Against Tampering and Decomposition
14:20 | 14:35
Attacks and Countermeasures for Capacitive PUF-Based Security Enclosures
Kathrin Garb – Fraunhofer Institute AISEC
14:35 | 14:50
Aging Prediction of Integrated Circuits Using Ring Oscillators and Machine Learning
Korey Arvin –University of Cincinnati
14:50 | 15:05
Fuzzy Key Generator Design using ReRAM-Based Physically Unclonable Functions
Ashwija Reddy Korenda –Northern Arizona University
15:05 | 15:20
Live Q&A
SESSION XI: Trojans and Backdoors: Detection and Prevention
15:20 | 15:35
CRESS: Framework for Vulnerability Assessment of Attack Scenarios in Hardware
Reverse Engineering
Matthias Ludwig – Infineon Technologies AG
15:35 | 15:50
Surreptitiously Adding a Microcontroller to a Printed Circuit Board
Dr. Sam Russ – University of South Alabama
15:50 | 16:05
Detection of Anomalous Integrated Circuits Using a Cavity Resonator System With
Machine Learning
Aditya Nechiyil – The Ohio State University
16:05 | 16 :20
Live Q&A
SESSION XII: Special Session: Red Team Activities
16:20 | 16:35
Risk Mitigation in the Design of Complex Systems Through IV&V
Warren Savage – University of Maryland
16:35 | 16:50
Emulating Adversaries and Measuring Outcomes for Logic Locking
Dr. Ramesh Karri, Dr. Benjamin Tan – New York University
16:50 | 17:05
Red Teaming Whys and Hows: A Logic Obfuscation Perspective
Dr. Ankur Srivastava, Dr. Yuntao Liu – University of Maryland
17:05 | 17:20
Live Q&A
17:20 | 17:35
Closing Remarks
General chair and Program chair
Sponsorship Tiers & Benefits
Diamond Sponsor: $7,500
Three complimentary registrations.
Banner at registration identifying your company as Diamond Sponsor.
Provides a complimentary table in the workshop to showcase instruments, demos, and/or brochures.
The company logo appears, as a Diamond Sponsor, on our conference program booklet and on the slides that appear between the sessions, including the plenary session.
Logo recognition and link to the company’s website on the official conference website.
Platinum Sponsor: $5,000
Two complimentary registrations.
Provides a complimentary table in the workshop to showcase instruments, demos, and/or brochures.
The company logo appears, as a Platinum Sponsor, on our conference program booklet and on the slides that appear between the sessions.
Logo recognition and link to the company’s website on the official conference website.
Gold Sponsor: $3,500
One complimentary registration.
The company logo appears, as a Gold Sponsor, on our conference program booklet and on the slides that appear between the sessions.
Logo recognition and link to the company’s website on the official conference website.
Sponsorship Tiers & Benefits
Diamond Sponsor: $5,000
Three complimentary registrations.
Sponsored mini-movie advertisement
Highest level of exposure
Promotion as Diamond Sponsor on website
Recognition as Diamond Sponsor in the program, including the plenary session