the White Hats have in a World Full of Black Hats?
Mike Borza– Synopsys Inc.
09:30 | 09:40
Break
SESSION I: Supply Chain Security
09:40 | 10:00
Assurance – From Integrated Circuits to Printed
Circuit Boards
Dr. Richard Ott -Air Force Research Lab
10:00 | 10:20
Replicating a Nation-State-Style Chipping Attack on
Cisco Firewalls
Monta Elkins – Foxguard Solutions/Sans Institute
10:20 | 10:40
Practical Design and Implementation of Zero-Trust
Supply Chain for Electronic Products
Phil Vachon and Joel Even – Bloomberg
10:40 | 11:00
The Secret Life of Supply Chains – Security at
Hardware Level
Sophia d’Antoine – Margin Research
11:00 | 11:10
Break
SESSION II: PCB Assurance
11:10 | 11:30
Electronic Component Solderability Assessment
Algorithm by Deep External Visual Inspection
Dr. Eyal Weiss – Cybord Inc.
11:30 | 11:50
Techniques to Thwart Surreptitiously Altered PCBs
Dr. Samuel Russ – University of South Alabama
11:50 | 12:10
SHADE: Automated Refinement of PCB Component
Estimates Using Detected Shadows
Nathan Jessurun – University of Florida
12:10 | 13:10
Lunch and Learn – 12:10 – 13:10
Live Demo (Cyberoptics): 12:40 – 13:10
13:10 | 13:40
Keynote Talk II: “Intrinsic and Extrinsic Process
Modalities for IC Security”
Ezra hall – GlobalFoundaries
13:40 | 13:50
Break
SESSION III: Panel Discussion
13:50 | 14:50
Package Security
Panelists:
Dr. John Allgair (BRIDG), David Kehlet (Intel), Wes Hansford
(Boeing Research & Technology),and Dr. Norman Chang
(Ansys)
Moderator:
Dr. Waleed Khalil, Ohio State University
14:50 | 15:00
Break
SESSION IV: Side-Channel Attacks
15:00 | 15:20
Toward an RF Side-Channel Reverse-Engineering
Tool
Dr. Stergios Papadakis – Johns Hopkins University
15:20 | 15:40
Strengthening Side-Channel Attacks: Combined
Distinguishers using Preprocessing Techniques
Dr. Selcuk Kose – University of Rochester
15:40 | 16:00
Detection and Prevention of Power Side-Channel
Attack
Dr. Swaroop Ghosh – Penn State University
16:00 | 16:20
Reverse Engineering Neural Networks through
Physical Side-Channels
Dr. Aydin Aysu– NC State University
16:20 | 16:40
Compromising Devices Security via NVM Controller
Vulnerability
Dr. Sergei Skorobogatov – University of Cambridge
Closing Day 1
Day 2 (December 16, 2020)
09:00 | 09:30
Keynote Talk III: “Fast, 100% 3D Wafer Bump
Metrology and Inspection to Improve Yields and 3D
System Integration”
Timothy Skunes, CyberOptics
09:30 | 09:40
Break
SESSION V : IC Assurance
09:40 | 10:00
Trust and Assurance Challenges for Heterogeneous
Integration and Packaging Technologies
Dr. John Allgair – BRIDG
10:00 | 10:20
Decoding & Defending the Trusted Platform Module
Against Malicious Hardware Implants
Suehayla (Sue) Mohieldin – River Loop Security
10:20 | 10:40
From Silicon to Simulation: A Full End-to-End
Decomposition of a Fabricated 130 nm Serial
Peripheral Interface for Establishing a Hardware
Assurance Baseline Root-of-Trust
Dr. Adam Kimura, Battelle
10:40 | 11:00
Automated Detection and Localization of
Counterfeit Chip Defects by Texture Analysis in
Infrared (IR) Domain
Pallabi Ghosh – University of Florida
11:00 | 11:20
Tracking Cloned Electronic Components using a
Consortium-Based Blockchain Infrastructure
Jason Vosatka – University of Florida
11:20 | 11:30
Break
SESSION VI: SoC Protection and Vulnerabilities
11:30 | 11:50
Security along SoC Design Lifecycle: Current
Practices and Challenges Ahead
Dr. Magdy Abadir – Caspia Technologies
11:50 | 12:10
ReCon: From the Bitstream to Piracy Detection
Grant Skipper – Indiana University
12:10 | 12:30
SPARTA-COTS: A Laser Probing Approach for
Sequential Trojan Detection in COTS Integrated
Circuits
Andrew Stern – University of Florida
12:30 | 13:30
Lunch/Sponsor Showcase
13:30 | 14:00
Keynote Talk IV: “Machine Learning for Circuit
Extraction Based on IC Images”
Dr. Bah-Hwee Gwee – Nanyang Technological University,
Singapore
14:00 | 14:10
Break
SESSION VII: Advanced Imaging and Sample Preparation
14:10 | 14:30
Sample Mounting Methods for Precision
Delayering of 130 nm Integrated Circuit Devices
Jon Scholl – Battelle
14:30 | 14:50
New Physical Analysis Capability for Counterfeit
Electronics and Reverse Engineering
Gregory M. Johnson – Zeiss
14:50 | 15:10
Semi-Supervised Automated Layer Identification
of X-ray Tomography Imaged PCBs
Ulbert Botero – University of Florida
15:10 | 15:20
Break
SESSION VIII: IP Protection
15:20 | 15:40
ATPG-Guided Fault Injection Attacks on Logic
Locking
Dr. Ujjwal Guin – Auburn University
15:40 | 16:00
Challenges and Opportunities in Physical Attacks
on Logic Locking
Dr. Jeyavijayan Rajendran – Texas A&M University
16:00 | 16:20
Using Digital Sensors to Leverage Chips’ Security
Dr. Naghmeh Karimi – University of Maryland, Baltimore
County
16:20 | 16:40
Benefits and Challenges of Utilizing Hardware
Performance Counters for COPPA Detection
Dr. Kanad Basu – University of Texas at Dallas
Sponsorship Tiers & Benefits
Diamond Sponsor: $7,500
Three complimentary registrations.
Banner at registration identifying your company as Diamond Sponsor.
Provides a complimentary table in the workshop to showcase instruments, demos, and/or brochures.
The company logo appears, as a Diamond Sponsor, on our conference program booklet and on the slides that appear between the sessions, including the plenary session.
Logo recognition and link to the company’s website on the official conference website.
Platinum Sponsor: $5,000
Two complimentary registrations.
Provides a complimentary table in the workshop to showcase instruments, demos, and/or brochures.
The company logo appears, as a Platinum Sponsor, on our conference program booklet and on the slides that appear between the sessions.
Logo recognition and link to the company’s website on the official conference website.
Gold Sponsor: $3,500
One complimentary registration.
The company logo appears, as a Gold Sponsor, on our conference program booklet and on the slides that appear between the sessions.
Logo recognition and link to the company’s website on the official conference website.
Sponsorship Tiers & Benefits
Diamond Sponsor: $5,000
Three complimentary registrations.
Sponsored mini-movie advertisement
Highest level of exposure
Promotion as Diamond Sponsor on website
Recognition as Diamond Sponsor in the program, including the plenary session