PAINE 2018 Program (June 24, 2018 at San Francisco, CA, USA)

8:00
|
8:10

Opening Remarks

Mark Tehranipoor (steering committee)

Invited Talk  1 

(Session chair: Navid Asadi)


8:10
|
8:40

Invited Talk – Securely Storing Chip ID during IC

Fabrication

David K. Lam, Chairman and CEO, Multibeam Corporation

8:40
|
9:05

Invited Talk – Microscopy Challenges Encountered

in Reverse Engineering Advanced Node Technology

ICs

Brenda Prentizer, President and CEO, Nanospective

9:05
|
9:25

Break

Paper Session 1: Fault injection (Session Chair: Saverio Fazzari)

9:25
|
9:45

“Assessment of a Chip Backside Protection”

Elham Amini, A. Beyreuther, N. Herfurth, Bernd Szyszka, and

Christian Boit – Technical, University of Berlin

9:45
|
10:05

“Design and Implementation of a Negative Voltage

Fault Injection Attack Prototype”

Christian Kudera, Markus Kammerstetter, Markus Mullner,

Daniel Burian, and Wolfgang Kastner, Trustworks KG –

Techinical University of  Wien

10:05
|
10:25

“Nanopyramid: An Optical Scrambler Against

Backside Probing Attacks”

Haoting Shen, Navid Asadi, Domenic Forte, Mark

Tehranipoor – University of Florida

10:25
|
10:45

Break

Invited Talk  2 (Session chair: Brian Cohen)

10:45
|
11:10

Invited Talk – Hardware Security Implications of

Reliability, Remanence and Recovery in Embedded

Memory

Sergei SkorogobatovUniversity of Cambridge

11:10
|
11:35

Invited Talk – On the Impact of Reverse Engineering

on Integrated Circuit Security

Oliver Thomas, Founder and CTO, Texplained

11:35
|
12:00

Invited Talk – Steps Toward Automated

Deprocessing of Integrated Circuits

Ed Principe, President and CEO, Synchrotron Inc.

12:00
|
13:00

Lunch

13:00
|
14:10

Panel Discussion

“Crossroad Between Physical Inspection and

Hardware Security”

Panelists: Saverio Fazzari, Ted Lundquist, Oliver Thomas,

Domenic Forte

Moderator: Mark Tehranipoor

Paper Session 2: Physical Inspection (Session chair: Walter Patrick Hays and Yousef Iskander)

14:10
|
14:30

“Large-Area Automated Layout Extraction

Methodology for Full-IC Reverse Engineering”

Raul Quijada, Roger Dura,Jofre Pallarès, Xavier Formatjé,

Salvador Hidalgo, Francisco Serra-Graells

Instituto de  Microelectrónica de Barcelona, IMB-CNM (CSIC)

– Universitat Autònoma de Barcelona,

14:30
|
14:50

“Computer Aided IC Reverse Engineering

Methodology on the Basis of the TI DST80

Cryptographic Immobilizer Tag”

Markus Kammerstetter, Markus Muellner, Daniel Burian,

Christian Kudera, and Wolfgang Kastner Trustworks KG –

Techinical University of  Wien

14:50
|
15:10

“Detecting Hardware Trojans Inserted by Untrusted

Foundry using Physical Inspection and Advanced

Image Processing Techniques”

Nidish Vashistha, M T Rahman, Haoting Shen, Damon L

Woodard, Navid Asadi and Mark Tehranipoor– University of

Florida

15:10
|
15:30

“The Past, Present, and Future of Physical Security

Enclosures: From Battery-Backed Monitoring to

PUF-Based Inherent Security and Beyond”

Johannes Obermaier, Vincent Immler – Fraunhofer Institute

AISEC

15:30
|
16:00

Break

Invited Talk  3:  (Session chair: Adam Waite)

16:00
|
16:25

Invited Talk – Effective Reverse Engineering with

Partial Information

Lisa Mcllrath, Senior Security Technical Lead, Draper

16:25
|
16:50

Invited Talk – How fast is imaging a full die…

with the world’s fastest SEM?

Lorenz Lechner, Technical Lead, Zeiss

16:50
|
17:00

Concluding Remarks

Program and general chair