David K. Lam, Chairman and CEO, Multibeam Corporation
8:40 | 9:05
Invited Talk – Microscopy Challenges Encountered
in Reverse Engineering Advanced Node Technology
ICs
Brenda Prentizer, President and CEO, Nanospective
9:05 | 9:25
Break
Paper Session 1: Fault injection (Session Chair: Saverio Fazzari)
9:25 | 9:45
“Assessment of a Chip Backside Protection”
Elham Amini, A. Beyreuther, N. Herfurth, Bernd Szyszka, and
Christian Boit – Technical, University of Berlin
9:45 | 10:05
“Design and Implementation of a Negative Voltage
Fault Injection Attack Prototype”
Christian Kudera, Markus Kammerstetter, Markus Mullner,
Daniel Burian, and Wolfgang Kastner, Trustworks KG –
Techinical University of Wien
10:05 | 10:25
“Nanopyramid: An Optical Scrambler Against
Backside Probing Attacks”
Haoting Shen, Navid Asadi, Domenic Forte, Mark
Tehranipoor – University of Florida
10:25 | 10:45
Break
Invited Talk 2 (Session chair: Brian Cohen)
10:45 | 11:10
Invited Talk – Hardware Security Implications of
Reliability, Remanence and Recovery in Embedded
Memory
Sergei SkorogobatovUniversity of Cambridge
11:10 | 11:35
Invited Talk – On the Impact of Reverse Engineering
on Integrated Circuit Security
Oliver Thomas, Founder and CTO, Texplained
11:35 | 12:00
Invited Talk – Steps Toward Automated
Deprocessing of Integrated Circuits
Ed Principe, President and CEO, Synchrotron Inc.
12:00 | 13:00
Lunch
13:00 | 14:10
Panel Discussion
“Crossroad Between Physical Inspection and
Hardware Security”
Panelists: Saverio Fazzari, Ted Lundquist, Oliver Thomas,
Domenic Forte
Moderator: Mark Tehranipoor
Paper Session 2: Physical Inspection (Session chair: Walter Patrick Hays and Yousef Iskander)
14:10 | 14:30
“Large-Area Automated Layout Extraction
Methodology for Full-IC Reverse Engineering”
Raul Quijada, Roger Dura,Jofre Pallarès, Xavier Formatjé,
Salvador Hidalgo, Francisco Serra-Graells
Instituto de Microelectrónica de Barcelona, IMB-CNM (CSIC)
– Universitat Autònoma de Barcelona,
14:30 | 14:50
“Computer Aided IC Reverse Engineering
Methodology on the Basis of the TI DST80
Cryptographic Immobilizer Tag”
Markus Kammerstetter, Markus Muellner, Daniel Burian,
Christian Kudera, and Wolfgang Kastner
Trustworks KG –
Techinical University of Wien
14:50 | 15:10
“Detecting Hardware Trojans Inserted by Untrusted
Foundry using Physical Inspection and Advanced
Image Processing Techniques”
Nidish Vashistha, M T Rahman, Haoting Shen, Damon L
Woodard, Navid Asadi and Mark Tehranipoor– University of
Florida
15:10 | 15:30
“The Past, Present, and Future of Physical Security
Enclosures: From Battery-Backed Monitoring to
PUF-Based Inherent Security and Beyond”
Johannes Obermaier, Vincent Immler – Fraunhofer Institute
AISEC
15:30 | 16:00
Break
Invited Talk 3: (Session chair: Adam Waite)
16:00 | 16:25
Invited Talk – Effective Reverse Engineering with
Partial Information
Lisa Mcllrath, Senior Security Technical Lead, Draper
16:25 | 16:50
Invited Talk – How fast is imaging a full die…
with the world’s fastest SEM?
Lorenz Lechner, Technical Lead, Zeiss
16:50 | 17:00
Concluding Remarks
Program and general chair
Sponsorship Tiers & Benefits
Diamond Sponsor: $7,500
Three complimentary registrations.
Banner at registration identifying your company as Diamond Sponsor.
Provides a complimentary table in the workshop to showcase instruments, demos, and/or brochures.
The company logo appears, as a Diamond Sponsor, on our conference program booklet and on the slides that appear between the sessions, including the plenary session.
Logo recognition and link to the company’s website on the official conference website.
Platinum Sponsor: $5,000
Two complimentary registrations.
Provides a complimentary table in the workshop to showcase instruments, demos, and/or brochures.
The company logo appears, as a Platinum Sponsor, on our conference program booklet and on the slides that appear between the sessions.
Logo recognition and link to the company’s website on the official conference website.
Gold Sponsor: $3,500
One complimentary registration.
The company logo appears, as a Gold Sponsor, on our conference program booklet and on the slides that appear between the sessions.
Logo recognition and link to the company’s website on the official conference website.
Sponsorship Tiers & Benefits
Diamond Sponsor: $5,000
Three complimentary registrations.
Sponsored mini-movie advertisement
Highest level of exposure
Promotion as Diamond Sponsor on website
Recognition as Diamond Sponsor in the program, including the plenary session