Keynote Talk I: The Future of Collaboration Across
Boundaries in Microelectronics
Dr. Donna Joyce – Army
09:35 | 09:55
Break
SESSION I: Paper Presentations
Chair: Dr. Biswajit Ray – The University of Alabama in Huntsville
09:55 | 10:15
Beware of Discarding Used SRAMs: Information is
Stored Permanently for PCB-Level Hardware Trojan
Detection using Capacitive Sensor
Joshua Hovanes -Auburn University
10:15 | 10:35
EM-Fault It Yourself: Building a Replicable EMFI Setup
for Desktop and Server Hardware
Niclas Kuhnapfel – Technical University of Berlin
10:35 | 10:55
An End-to-End Marking Recognition System for PCB
Optical Inspection
Shajib Ghosh – University of Florida
10:55 | 11:15
Break
SESSION II: Invited Talk
Chair: Dr. Adam Kimura – Battelle
11:15 | 11:35
Parts Management Guidance Advanced Packaged
Electronics
Jeffrey Jarvis – Army DEVCOM AvMC Parts Reliability
11:35 | 11:55
Security assessment of non-volatile memories through
direct binary data extraction
Liu Qing – Temasek Laboratories, Nanyang Technological University
11:55 | 13:30
Lunch and Exhibit
SESSION III: PANEL DISCUSSION
Moderator: Dr. Waleed Khalil – Ohio State University
13:30 | 15:00
The Future of PAINE: The Next Decade of Physical
Assurance
Speakers:
Dr. Richard Ott – Air Force Research Laboratory,
Nir Sever – ProteanTecs,
Dr. Adam Kimura – Battelle Memorial Institute,
Jasper Woudenberg – Riscure.
15:00 | 15:20
Break
SESSION IV: POSTER PRESENTATION Chair: Dr. Kanad Basu – University of Texas at Dallas
17:30 | 19:30
Reception
End of Day 1
Day 2(October 26, 2022)
07:40 | 08:40
Registration and Breakfast
Plenary Session II
Chair: Dr. Bob Overbeek – Radiance Technologies
08:40 | 09:20
Keynote Talk II: Elevating Chip Fabrication Variations to
Security at Application Level
Dr. Gang Qu – NSF
09:20 | 09:40
Break
SESSION V: Paper Presentations
Chair: Dr. Kanad Basu – University of Texas at Dallas
09:40 | 10:00
Automated Transfer Learning Model for Counterfeit IC
Detection
Shajib Ghosh – University of Florida
10:00 | 10:20
Printed Circuit Board inspection: Fusion of Optical and
X-rayimages (FOXi) for electronic components
classification
Sebelan Danishvar – Brunel University
10:20 | 10:40
Automated Structure Matching of Printed Circuit Boards
Calvin Hirsch – Two Six Technologies
10:40 | 11:00
Break
SESSION VI: Invited Talk
Chair: Dr. white Paul D. Hale – NIST
11:00 | 11:20
Machine Vision based Total Assurance: Traceability and
Conformance from wafer to package to PCB.
Dr. Naresh Menon– Chromologic
11:20 | 11:40
Mixed Signal Approach to IP Protection and
Obfuscation
Dr. Nima Maghari– University of Florida
11:40 | 12:00
Heterogeneous Integration Challenges and
Opportunities in 5G / 6G era
Dr. Yong-Kyu Yoon – University of Florida
12:00 | 13:15
Lunch and Exhibit
SESSION VII: PANEL DISCUSSION
Moderator: Dr. Aydin Aysu – North Carolina State University
13:15 | 14:45
Secure Packaging: Initiatives, Research, and Workforce
Development
Panelists:
Dr. Madhavan Swaminathan – Georgia Institute of Technology,
Dr. Gang Qu – NSF,
Peter O’Donnell – Army CCDC,
Saverio Fazzari – Booz Allen Hamilton ,
Dr. Charlie Hudnall – The University of Southern Mississippi
14:45 | 15:15
Break
SESSION VIII: Invited Talk
Chair: Dr. Mehdi Sadi – Auburn University
15:15 | 15:35
Modeling and Simulation of Cyber Physical Systems for
Cybersecurity Research
Dr. Tommy Morris– University of Alabama in Huntsville
15:35 | 15:55
Hardware & Supply Chain Assurance: Challenges and
Advantages of Automation
Beau Bakken – Caspia Technologies
15:55 | 16:15
Heterogeneous Integration / Challenges with CHIPS Act
Sultan Lilani – Integra Technologies
16:15 | 16:35
Break
SESSION IX: Paper Presentations
Chair: Gregory Fritz – Draper
16:35 | 16:55
Single Image Printed Circuit Board Functional Similarity
Clustering using Vision Transformers
Dr. Alex Fafard – – Two Six Technologies
16:55 | 17:15
Timing Camouflage Enabled State Machine Obfuscation
Michaela Brunner – -Technical University of Munich
17:15 | 17:35
PCBA Image Analysis: A Comparison Of Visible, Infrared
& X-ray Wavelengths
Ben Malin – Brunel University London
End of Day 2
Day 3(October 27, 2022)
07:20 | 08:20
Registration and Breakfast
SESSION X: Invited Talk
Chair: Allen Krell – Invariant
08:20 | 08:40
Muli-Modal Non-Destructive Evaluation with Digital
Tomosynthesis 3D X-ray to reduce counterfeit ingress
and increase batch sampling via faster throughput
Andy Barnes – Adaptix Ltd
08:40 | 09:00
Accelerating High Resolution X-ray Tomography of Large
PCBs
Jeff Gelb – Sigray, Inc.
09:00 | 09:20
Deeper Scan – A rapid solution for (counterfeit) device
identification and the detection of device tampering,
utilising X-ray imagery
Jay Richards – NWPRO
09:20 | 09:40
Break
SESSION XI: Paper Presentations
Chair: Dr. Heath Berry – Radiance Technologies
09:40 | 10:00
Ferroelectric Materials: Enabling Programmable Process
Control Monitors
Rashmi Jha – University of Cincinnati
10:00 | 10:20
Utilization of Impedance Disparity Incurred from
Switching Activities to Monitor and Characterize
Firmware Activities
Md Sadik Awal – Florida International University
10:20 | 10:40
Towards PCB Netlist Extraction from Multimodal
Imagery
Anthony George – Battelle Memorial Institute
10:40 | 11:00
Break
SESSION XII: Paper Presentations
Chair: Dr. Adam Waite – Battelle
11:00 | 11:20
Unsupervised Domain Adaptation with Histogram-gated
Image Translation for
Delayered IC Image Analysis
Yee-Yang Tee – Nanyang Technological University
11:20 | 11:40
Target preparation methodology for semi-invasive
attacks on microcontrollers
Rodrigo Silva Lima – ALPhANOV – Mines Saint-Etienne
11:40 | 12:00
Automated Stitching of Noisy Scanning Electron
Microscopy Images for Integrated
Circuit Reverse
Engineering
Michael Pucher – University of Vienna
12:00 | 12:20
VeriGene: A Tool for the Creation of DNA
Representations for Hardware Security Analysis
Nicholas Haehn – University of Cincinnati
12:20 | 13:30
Lunch and “University Labs Virtual Tour”
University Participants:
The University of Alabama in Huntsville
University of Florida
Nanyang Technological University – Singapore
Brunel university – London
North Carolina State University
Auburn University
Centre Microélectronique Provence – France
13:30 | 13:45
Lunch
Sponsorship Tiers & Benefits
Diamond Sponsor: $7,500
Three complimentary registrations.
Banner at registration identifying your company as Diamond Sponsor.
Provides a complimentary table in the workshop to showcase instruments, demos, and/or brochures.
The company logo appears, as a Diamond Sponsor, on our conference program booklet and on the slides that appear between the sessions, including the plenary session.
Logo recognition and link to the company’s website on the official conference website.
Platinum Sponsor: $5,000
Two complimentary registrations.
Provides a complimentary table in the workshop to showcase instruments, demos, and/or brochures.
The company logo appears, as a Platinum Sponsor, on our conference program booklet and on the slides that appear between the sessions.
Logo recognition and link to the company’s website on the official conference website.
Gold Sponsor: $3,500
One complimentary registration.
The company logo appears, as a Gold Sponsor, on our conference program booklet and on the slides that appear between the sessions.
Logo recognition and link to the company’s website on the official conference website.
Sponsorship Tiers & Benefits
Diamond Sponsor: $5,000
Three complimentary registrations.
Sponsored mini-movie advertisement
Highest level of exposure
Promotion as Diamond Sponsor on website
Recognition as Diamond Sponsor in the program, including the plenary session