IEEE International Conference
on PHYSICAL ASSURANCE and
INSPECTION of ELECTRONICS (PAINE)
PAINE 2023 Winners
Best Paper
Be a sense of self for power side-channel signatures: Time-
series
Side-channel Disassembler (TSD) and Integrity Monitor
(TSD-IM)
Random Gwinn
Johns Hopkins University – Applied Physics Laboratory
Best Lab Demo
Secured Embedded Architecture Laboratory(SEAL)
Director: Debdeep Mukhopadhyay
Video 1
Indian Institute of Technology Kharagpur – India
Best Poster
Experimental Characterization of Two-Photon Optical Beam Induced Current Imaging for Microelectronics Assurance
Ryan J. Patton, Anthony George, Adam Kimura, Jamin McCue
Battelle Memorial Institute – Air Force Research Laborator