IEEE International Conference
on PHYSICAL ASSURANCE and
INSPECTION of ELECTRONICS (PAINE)

PAINE 2023 Winners

 
Best Paper
Be a sense of self for power side-channel signatures: Time-
series
Side-channel Disassembler (TSD) and Integrity Monitor 
(TSD-IM)

Random Gwinn
Johns Hopkins University – Applied Physics Laboratory

Best Lab Demo

Secured Embedded Architecture Laboratory(SEAL)
Director: Debdeep Mukhopadhyay
Video 1 
Indian Institute of Technology Kharagpur – India

Best Poster

Experimental Characterization of Two-Photon Optical Beam Induced Current Imaging for Microelectronics Assurance
Ryan J. Patton, Anthony George, Adam Kimura, Jamin McCue
Battelle Memorial Institute – Air Force Research Laborator